HT capillaries have higher abrasion-resistant characteristics than CERUNA material so they are suitable for copper wire bonding or semiconductor packages prone to the abrasion of capillary tip.
Feature High abrasion-resistant characteristics, Long life, Good chemical resistance
Composition Al2O3 + ZrO2(Nano)+Cr2O3+α
Density(g/㎤) 4.4
Relative Density(%) 99.91
Hardness(MPa) 1,950
Grain size(㎛) > 0.8
Toughness(Mpa.m^0.5) 4.3