The capillary is used for all type of bonding machine in the semiconductor assembly process.
The main purpose of capillary is to connect the Chip pad which is gate of circuit terminal and Lead frame by using Gold wire with high fever and ultrasonic waves.
1. Good durability for 2,300V, heat resistance for Spark and wear resistance.
2. Good ultrasonic waves transmissibility for Fine Pitch(Tip Size: Below 80) capillary.
3. Good shape for long life time without any contamination.